Engineering analysis, practical perspectives on China operations, and high-voltage IC design experience.
A 200 mm SiC wafer has about 1.78 times the area of a 150 mm wafer, but buyers pay for accepted devices. Learn how to compare cost per accepted die and what evidence to ask suppliers for.
Read More →Manufacturing, packaging & test · China ecosystem & qualification
How an EV traction pack connects safely to its inverter and lets go when something fails: precharge, contactors, fuses, pyro disconnects, drivers and the energy that remains afterwards.
Read More →Power electronics & applications
A hypothetical failed converter shows why SiC and GaN failure analysis should start with preserved evidence, a method matched to the question, and an agreed hold point before any irreversible step, such as opening the package or cutting.
Read More →Manufacturing, packaging & test
Support for supplier communication, local operations and understanding production conditions in China.
See How We Help →Explore high-voltage amplifiers, gate drivers, and motor and actuator drivers, with target specifications and operating notes.
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