AI infrastructure is not only a GPU story. Rising rack power, fast load transients, 48 V rack limits, and emerging 800 VDC architectures are moving hard problems back into analog and power IC design. The opportunity is real, but it must be framed as a source-backed design-space opening, not a guaranteed socket.
ADI’s 32-channel HV DAC driver family is in lifecycle transition. Here is what the drive current and settling delta means for OCS MEMS mirror designs – and what you need to validate.
OCS MEMS Driver ICs: Why Quasi-Static Mirrors Need Different Analog Thinking Read More »
Graphene is one of the most over-cited materials in semiconductor presentations. Most commercial “graphene” products are reduced graphene oxide or pyrolytic graphite, not monolayer CVD graphene. Two applications have crossed into commercial production. Everything else — including BEOL interconnects and logic transistors — is laboratory research. This insight separates the genuine near-term opportunities from the decade-long research bets.
High voltage alone does not force a ceramic package. Ceramic becomes compelling when voltage combines with high current, power dissipation, hermeticity, harsh environments, or long-life reliability requirements. The real growth is in EV power electronics, renewable inverters, AI data-center power, industrial drives, RF, aerospace, and medical high-voltage systems.
Co-packaged optics is shipping at the leading edge — Broadcom’s Bailly platform is customer-delivered — but the next switch generation and most published “CPO market size” figures are still a roadmap slide, not a 2026 reality. This insight separates what is actually deployed from what is announced, and shows where the AI-server and CPO power management opportunities genuinely differ in evidence and maturity.
TI TIDA-010979 and EPC23102 already validate the humanoid joint GaN thesis — and claim the reference platform position. A generic gate driver or GaN power stage competes head-on with both. The real opening is a companion IC for current sensing, safe-disable, and regen coordination.
GaN for Robot Joints: Why the Gate Driver Opportunity Is More Crowded Than You Think Read More »
The 3D printing market is growing, but the real power analog IC opportunity depends on printer architecture, printhead control, and who owns the waveform socket.