Piezo haptics, nanopositioning, ultrasonic cleaning, inkjet and medical ultrasound may all need high-voltage drive, but they require very different IC architectures. This practical map shows where each approach fits and where analog IC opportunities remain.
Piezo Driver ICs Are Not One Market Read More »
Solid-state transformers create real semiconductor demand, but not for one monolithic transformer chip. This evidence-led architecture map shows where SiC modules, isolated gate drivers, sensing, bias power, protection and control actually fit—and what must be proven before calling any function a custom-IC opportunity.
Where Solid-State Transformers Create Real Power-IC Opportunities Read More »
HVAC growth creates its strongest semiconductor openings in inverter gate drivers, PFC, motor control, sensing and protection. This load-first map separates repeatable platforms from specialized, safety-heavy functions.
Where HVAC Growth Really Creates Semiconductor Openings Read More »
The planned Navitas–Magnachip SiC transfer highlights a broader rule: masks and recipes may move, but manufacturing behavior, models, reliability, test and route-release evidence must be re-established.
When a Power or Analog Process Moves Fabs, What Must Be Re-Proven? Read More »
See where copper still wins, where fiber takes over, and how pluggable optics, LPO, CPO and optical I/O shift system responsibility.
At a 48/54 V AI-server input, protection must do more than limit inrush. Integrated eFuses and external-MOSFET hot-swap controllers make different tradeoffs in safe operating area, current scaling, thermal design, fault timing and telemetry. Here is how to compare them on equal terms.
Inside the 48 V AI-Server eFuse: Why 80 V-Class Protection Still Matters Read More »
The low-altitude economy extends far beyond passenger eVTOL. Industrial UAVs, cargo aircraft, docks, chargers, protected power distribution and diagnostic telemetry may create earlier opportunities for power-analog IC suppliers.
Beyond eVTOL: Where Power-Analog ICs Fit in the Low-Altitude Economy Read More »
At multi-kilovolt, hundreds-of-amp scale, device speed is only part of the contest. DC fault energy, always-on breaker losses, microsecond protection windows, hybrid architectures, packaging, and qualification increasingly decide which power-semiconductor systems are viable.
At HV/HC Scale, Protection — Not the Switch — Is Becoming the Battleground Read More »
800 VDC receives attention for GaN and SiC conversion, but the less-visible design frontier is the analog protection boundary that must connect, measure, diagnose, and isolate high-power compute trays.
At 800 VDC, Hot Swap Becomes the Analog Control Plane of the AI Rack Read More »
The useful question is not which process is better. It is whether isolation, thermal path, power-device integration, reliability, package, and test assumptions match the product risk.
SOI or BCD for High-Voltage Analog: Decide Before the Schematic Read More »