Design targets

Power-stage configuration

One integrated H-bridge with two half-bridge outputs

Supply-voltage target

12–55 V; transient and regeneration headroom required

Continuous output-current target

3 A class; subject to cooling, package and operating limits

Control inputs

Direction, brake and pulse-width modulation (PWM)

Current sensing

Upper-source current sensing; recirculating current excluded

Fault functions

Thermal-warning output, thermal shutdown and overcurrent protection objectives

Pin compatibility

Pin-assignment compatibility objective; final package selection deferred

Practical operating notes

• Design is complete and pre-silicon. The listed specifications are design targets, not measured results. The 3 A continuous-current class depends on heat removal, package choice, duty cycle, junction temperature and the voltage across the conducting power devices. It is not available unconditionally across every supply and load condition.
• The supply target is 12–55 V. Allow voltage margin for switching transients and regenerated energy, and evaluate bypassing, conduction losses and cooling. The supply voltage is not the available motor-output voltage at every load.
• Direction, brake and PWM commands require coordinated logic and transition timing. Brake behavior depends on the other control inputs; a brake command alone must not be assumed to turn all power outputs off. An external controller must manage the required motion and fault response.
• Current sensing reflects current through the upper sourcing transistors and excludes freewheeling or recirculating paths. It does not measure all motor-current paths, and its scale and interface require validation for the intended control loop.
• The thermal warning requires an external response and is distinct from automatic thermal shutdown. Overcurrent protection is not precision regulation at the 3 A target. Protection features do not justify repeated thermal shutdown or establish immunity to destructive hard shorts.
• The internal charge pump supports high-side bias, with external bootstrap capability for suitable switching conditions. Bootstrap components, switching frequency, duty cycle and load energy paths require application-specific validation.
• Package selection remains open. Pin assignments, mounting-tab connections, mechanical fit, thermal behavior and electrical operation must be validated before board-level interchangeability can be established.