ChinaSemiOps

A 200 mm SiC wafer has about 1.78 times the area of a 150 mm wafer, but buyers pay for accepted devices. Learn how to compare cost per accepted die and what evidence to ask suppliers for.

A hypothetical failed converter shows why SiC and GaN failure analysis should start with preserved evidence, a method matched to the question, and an agreed hold point before any irreversible step, such as opening the package or cutting.

A current-sense output spikes at a motor inverter switching edge. Learn when a reading can be trusted and which evidence to request.

A practical qualification workflow for alternative analog ICs: compare test conditions, validate the signal chain and record an application-specific release.

An RF amplifier module shows RF ports and separate power pins. This article maps six circuit functions to the analog and power IC classes that usually serve them, with one measurement and one fault question for each.

HTCC vs LTCC selection depends on the complete ceramic, conductor and assembly stack. Compare electrical loss, heat flow, sealing and production evidence.

Five processor labels overlap. Start with your AI workload, check software and memory, then map who designs, builds, packages and tests the system.

Start from the RF function, not the package name. This guide compares bare die, QFN and flanged housings, explains GaN bias order and heat path, and lists the evidence to request from a supplier.

A CPU or GPU VRM is more than its DrMOS power stages. See how controllers, phases, inductors and capacitors work together, why voltage dips when load jumps, and what TLVR changes.

A practical guide to radiation-hardened IC selection: connect dose and single-event evidence with analog accuracy, power protection and mission requirements.