Insights

A CPU or GPU VRM is more than its DrMOS power stages. See how controllers, phases, inductors and capacitors work together, why voltage dips when load jumps, and what TLVR changes.

How to plan an analog IC production handoff: what wafer test and final test each cover, why trim stage and package stress matter, and a proposed checklist for evidence, owners and release decisions.

A practical guide to radiation-hardened IC selection: connect dose and single-event evidence with analog accuracy, power protection and mission requirements.

A biosensing analog front end must match the sensor’s electrical output: ECG voltage, bioimpedance excitation or electrochemical current. See what vendor specifications do and do not tell you.

How sensing, signal conditioning and actuator feedback help engineers choose analog interfaces and validate fault response in AI-server liquid cooling.

A practical four-part framework for evaluating DrMOS interfaces, switching behavior, telemetry, protection, and board-level thermal performance.

Megawatt charging safety depends on more than a larger connector. This architecture guide maps which sensing, insulation, thermal and shutdown functions may merit integration—and which should remain external.

EV onboard charger technology is advancing through bidirectional architectures, SiC/GaN switching, control, isolation and thermal co-design. Here is the engineering decision map.

Inverter control ICs sit around the switch bridge. Use this function map to screen sensing, gate drive, protection, bias and telemetry opportunities by application.

48V AI rack power is becoming a conversion-boundary decision: retain an intermediate bus, move a high-ratio stage close to the accelerator, or use package-adjacent delivery. This public-source analysis maps the IC, PDN, thermal and service trade-offs.